CXMT DRAM Expansion Targets 600k Wafer Monthly Capacity in Beijing

CXMT plans to build a second DRAM wafer fab in Beijing Yizhuang, a move that challenges the long-standing dominance of Samsung, SK Hynix, and Micron. This expansion aims to double the company's total monthly capacity to 600,000 wafers. The project is funded by a recent 58 billion RMB IPO, which stands as a record for mainland semiconductor financing. Buyers monitoring supply chain shifts should note that this facility targets a significant increase in global market share.

New Beijing facility funded by record IPO aims to double monthly output

The new facility will be located in Beijing Yizhuang. CXMT completed its A-share IPO in early August to raise the necessary capital. The company intends to use these funds to accelerate production scaling. This investment marks a major step in their manufacturing strategy.

• New Facility Location: Beijing Yizhuang
• IPO Funding Raised: 58 billion RMB
• Target Monthly Capacity: 600,000 wafers
• 2026 Q1 Market Share: 8%
• 2028 Projected Market Share: 11%

CXMT targets a monthly capacity of 600,000 wafers for the new site. The exact investment size and production start date remain unannounced. Counterpoint projects that CXMT's global market share will reach 8% by the first quarter of 2026. This target reflects the expected impact of the expanded capacity.

The company projects its global market share will exceed 11% by 2028. This growth trajectory positions CXMT as a more significant player in the DRAM market. This expansion aims to alleviate current supply constraints in the memory sector. We've been tracking DRAM closely — see our earlier coverage on SK hynix DRAM Capacity Growth Slows.

CXMT is advancing its DRAM manufacturing capabilities with a new Beijing facility. The project relies on record-breaking IPO funding to reach 600,000 wafers monthly. Market share projections indicate a rise from 8% in 2026 to over 11% in 2028. The company continues to expand its footprint in the global memory market.