SK Hynix has introduced the SOCAMM2, a new memory module designed for high-performance computing environments. The company announced the product on the 20th without specifying the month or year. This release targets server environments while maintaining compatibility with mobile devices like smartphones.
The SOCAMM2 features a 192GB capacity built on sixth-generation 10-nanometer-class LPDDR5X low-power DRAM. It utilizes a thin profile and a compression-type connector to fit into compact server designs. The module is optimized for NVIDIA's Vera Rubin platform to support demanding workloads. NVIDIA's Vera Rubin
SK Hynix claims the SOCAMM2 delivers more than double the bandwidth of traditional RDIMMs while reducing power consumption by over 75 percent. The company states the memory can alleviate storage bottlenecks for AI large models with hundreds of billions of parameters during training and inference. These improvements aim to significantly enhance the processing speed of overall systems.
Delivers double bandwidth and cuts power by 75 percent
SOCAMM2 Specifications
- Capacity: 192GB
- DRAM Technology: Sixth-generation 10-nanometer-class LPDDR5X
- Form Factor: Thin profile with compression-type connector
- Target Platform: NVIDIA's Vera Rubin platform
The SOCAMM2 has begun mass production for global distribution. SK Hynix has not confirmed the specific launch window or pricing details for the new memory module.
Discussion
0 comments
Log in to join the thread with a thoughtful take, question, or correction.