Rambus announced a new memory module chipset solution on April 22. The product is named LPDDR SOCAMM2 Memory Module Chipset Solution. This release focuses on the supporting components for memory modules rather than the memory chips themselves.
The solution includes a Serial Presence Detect chip for module identification, configuration, and telemetry. It also integrates 12V and 3V voltage regulators for local high-efficiency power conversion. These components manage the power delivery and system communication for the memory module.
The announcement provides no pricing information for the chipset solution. The company also did not list any specific availability dates or distribution channels for this product. Buyers cannot currently purchase this specific chipset solution based on the available details.
New chipset supports SK Hynix modules with enhanced bandwidth and power efficiency
This chipset supports the broader SOCAMM2 memory ecosystem. SK Hynix recently began mass production of 192GB SOCAMM2 modules based on sixth-generation 10-nanometer LPDDR5X technology. Those modules target next-generation AI servers and the Nvidia Vera Rubin platform.
The SOCAMM2 standard aims to address storage bottlenecks in large AI models. The architecture offers a bandwidth increase of more than double compared to traditional RDIMM modules. It also reduces power consumption by over 75 percent relative to those legacy modules.
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