OpenAI is developing an AI-focused smartphone that will feature a customized MediaTek Dimensity 9600 system on chip. The processor will use TSMC's N2P manufacturing process, which represents a two-nanometer node. Analyst Ming-Chi Kuo reports the device targets production of 30 million units between 2027 and 2028.
Leaked specs reveal custom processor and AI-focused architecture for upcoming device
The smartphone architecture includes LPDDR6 RAM and UFS 5.0 storage for high-speed data handling. A dual-neural processing unit design will manage heterogeneous artificial intelligence tasks. The imaging system features an upgraded high dynamic range pipeline to improve visual perception capabilities.
Industry expectations place the launch window in the first half of 2027. OpenAI has not yet announced specific pricing or regional availability details for the device. The project remains in its development phase with final specifications and supply chain arrangements still pending confirmation.
The device represents a shift toward dedicated AI agent hardware rather than traditional smartphone applications. Ming-Chi Kuo's analysis suggests this platform will integrate deeply with OpenAI software services. Final technical details and manufacturing partners are expected to become clearer as the project progresses.
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