Alibaba Unveils Zhenwu M890 AI Chip With 144GB HBM3 Memory And 0.6 PFLOPs FP16 Compute Performance

Alibaba Cloud unveils Zhenwu M890 AI chip featuring 144GB HBM3 memory, 0.6 PFLOPs FP16 compute, and ICN Switch 1.0 interconnect for Agentic AI workloads with global availability soon.

Alibaba Unveils Zhenwu M890 AI Chip With 144GB HBM3 Memory And 0.6 PFLOPs FP16 Compute Performance

Alibaba Cloud unveiled the Zhenwu M890 AI chip and Qwen3.7-Max large language model at an event in Hangzhou on May 20, 2026.

New AI chip with custom PPU architecture and PCIe 5.0 support for training and inference workloads.

The M890 processor features a custom Parallel Processing Unit architecture with 144 GB of HBM3 memory and delivers 0.6 PFLOPs of FP16 compute performance. The chip supports PCIe 5.0 x16 connections and handles FP32, FP16, FP8, and FP4 formats for AI workloads.

Spec comparison

Spec Zhenwu M890
Memory 144 GB HBM3
Compute Performance 0.6 PFLOPs FP16
Interconnect Bandwidth 800 GB/s
Architecture In-house PPU (Parallel Processing Unit)
Zhenwu M890 AI chip with 144 GB HBM3 memory and PPU architecture for parallel processing workloads.

Alibaba Cloud introduced the ICN Switch 1.0 interconnect chip to support the M890, providing 25.6 Tb/s of bandwidth with a peer-to-peer delay under 150 nanoseconds. The company will integrate up to 128 M890 accelerators into the Panjiu AL128 Supernode Server rack.

Alibaba Cloud claims the Zhenwu M890 offers three times the compute performance of previous generation offerings and matches the A100 from in raw compute speed. The company also states the chip runs three times faster than the Hopper H20 solution, though these figures rely on internal testing without independent third-party verification.

Panjiu AL128 Supernode Server rack integrating 128 Zhenwu M890 AI accelerators for enterprise deployment.

The Zhenwu M890 will become available globally through Alibaba's Model Studio platform for developers soon. Alibaba Cloud has shipped approximately 560,000 Zhenwu AI chips to date across twenty industries and outlined a roadmap that includes the V900 chip in Q3 2027 and the J900 model in Q3 2028.

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