Alibaba has unveiled its Zhenwu AI chip roadmap at the Alibaba Cloud Summit 2026. The company announced the Zhenwu M890, a new training and inference chip, along with plans for two future models.
M890 delivers triple the performance of its predecessor.
The Zhenwu M890 features 144GB of HBM memory and an interconnect bandwidth of 800GB/s. Its performance is three times that of the previous Zhenwu 810E. The company also announced a 128-supernode server with an ICN Switch 1.0.
The Zhenwu V900 is scheduled for Q3 2027. It will offer 216GB of HBM memory and 1200GB/s interconnect bandwidth, with performance three times that of the M890. A third chip, the Zhenwu J900, is planned for Q3 2028 and will represent an architecture leap. Its specifications have not been disclosed.
Cumulative shipments of the Zhenwu series have reached 560,000 units. Alibaba has not confirmed pricing for any of the announced chips.
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