Huawei plans to release the Kirin 9050 system-on-chip for its upcoming Mate 90 series smartphones.
Analysts claim new stacking tech boosts performance over older nodes
The chip will reportedly use a new 3D IC stacking manufacturing technique from SMIC to overcome older process node limitations.
CITIC Securities analyst Yu Fangbo claims the Kirin 9050 will outperform Apple's A18 Pro processor in benchmark tests.
Huawei intends to implement its LogicFolding Design technology to increase transistor density and improve clock speeds.
The performance comparison relies on alleged test results that lack specific metrics and power draw details.
Analysts warn that the claims may reflect controlled laboratory environments rather than real-world device conditions.
Power consumption figures remain unverified in the current reports from industry observers.
Huawei has not officially confirmed the launch timeline or technical specifications for the Kirin 9050 chipset.
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