Huawei announced a roadmap to achieve chip manufacturing equivalent to TSMC's 1.4nm process by 2031.
LogicFolding Design technology unveiled for upcoming Kirin chipsets
The company also unveiled LogicFolding Design technology for upcoming Kirin chipsets during the announcement.
Achieving this level of lithography typically requires ASML's High-NA EUV equipment, which remains restricted under U.S. sanctions.
Huawei may rely on domestic alternatives like SiCarrier and Chinese EUV machinery entering trial production in Q3 2025 to reach its goals.
TSMC plans to begin mass production of its own 1.4nm wafers by 2028 after investing an estimated $49 billion across four plants.
The vendor has not confirmed specific technical details on how it will overcome current manufacturing restrictions.
Industry observers note the ambitious timeline faces significant hurdles without access to advanced foreign tools.
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