Thermalright has released the AXP120-X77, a compact air cooler designed specifically for small form factor PCs. This 77mm height model targets users building in ITX cases where vertical motherboard mounting creates airflow challenges. The release gives builders a dedicated low-profile solution that addresses heat return issues common in tight chassis spaces.
Compact cooler targets vertical motherboard heat dissipation
The cooler ships with a TL-B12015 EX fan featuring LCP blades and a dual ball bearing. Thermalright claims the fifth-generation AGHP reverse gravity heat pipes optimize performance for vertical setups. The unit also includes DTPC dynamic thermal design to manage peak CPU heat and standby limits.
Specifications
- Dimensions: 133.5 x 122 x 77mm
- Heatpipes: 5th Gen AGHP reverse gravity 6 heat pipes
- Fan Model: TL-B12015 EX
- Fan Bearing: Dual Ball Bearing
- Max Fan Speed: 3150 RPM
The AXP120-X77 measures 133.5 x 122 x 77mm and supports Intel LGA 1851, 1700, 115X, 1200, 2011 square, and 2066 sockets. It also works with AMD AM4 and AM5 platforms. The fan reaches 3150 RPM for 83.61 CFM airflow and 3.4mm H2O static pressure at 37.07 dB(A).
RAM clearance stands at 43mm, or 44mm if you remove the corner pad. The package includes TF7 thermal paste with a 12.8W/mK conductivity rating. Thermalright provides a six-year warranty for the unit.
The cooler is available in China starting September 7, 2024. Launch pricing is 239 CNY (around $35.49), with the standard price set at 259 CNY (around $38.46).
This product expands Thermalright's low-profile lineup for compact PC builders. It offers a specific solution for vertical mounting heat dissipation.
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