Suzhou Zhixin MEMS Micromirror Chip Breaks Overseas Monopoly

Suzhou Zhixin Sensing Technology released a public MEMS micromirror large array chip with 416 mirrors, targeting AI data center optical switching.

Suzhou Zhixin Sensing Technology Co., Ltd. MEMS Micromirror Large Array Chip
Suzhou Zhixin Sensing Technology Co., Ltd. MEMS Micromirror Large Array Chip

Suzhou Zhixin Sensing Technology Co., Ltd. has released a public version of its MEMS micromirror large array chip, a move that directly impacts the supply chain for AI data centers. This launch addresses a critical bottleneck in optical switching core components, offering a domestic alternative to previously monopolized overseas technology. Buyers relying on all-optical interconnection infrastructure now have a new local source for these essential hardware elements.

Suzhou Zhixin Sensing Technology releases a public MEMS micromirror large array chip designed for AI data center optical switching infrastructure.

The chip integrates 416 independent micromirror units on a single silicon substrate, utilizing an electrostatic drive dual-axis MEMS structure. Each micro-mirror unit deflects up to ±6.5 degrees on the X-axis and ±5.5 degrees on the Y-axis to direct light signals. The device maintains infrared reflectivity of at least 96 percent, ensuring efficient signal transmission within optical networks.

Specifications

  • Micro-mirror units: 416
  • Deflection angle: ±6.5° (X-axis), ±5.5° (Y-axis)
  • Infrared reflectivity: ≥96%
  • Response time: ≤10ms
  • Cycle life: >1 billion cycles

Technical specifications highlight a response time of 10 milliseconds or less and a cycle life exceeding one billion cycles. The package dimensions measure 33.6mm by 20.85mm by 0.66mm, allowing for dense integration in server racks. The company reports a manufacturing yield rate stable at over 90 percent, supported by 6-inch and 8-inch MEMS wafer production lines with a monthly capacity of 10,000 wafers.

This component targets All-Optical Switching (OCS) systems for AI computing clusters, supporting a port scale of 400×400. Industry experts state that this release breaks the overseas monopoly in optical switching core components and provides a solid foundation for autonomous and controllable all-optical interconnection. The company aims to expand its roadmap toward 1024×1024 port specifications in the future.

The standard public version chip launched in China in August 2026 for industry customers. This release marks a substantial step in the localization process of all-optical switching technology in China. We looked at the broader context of domestic semiconductor advancements while tracking these AI infrastructure developments.

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