Samsung Electronics is developing a new packaging technology for mobile devices called Multi-layer Stack FOWLP. The technology is designed for next-generation HBM packaging and could debut in later versions of the Exynos 2800 or Exynos 2900 processors.
New packaging boosts bandwidth and stacking layers
Multi-layer Stack FOWLP combines high aspect ratio copper pillars with fan-out wafer-level packaging and optimizes vertical connection structures. It increases I/O terminals without requiring extra space, which boosts bandwidth by 15 to 30 percent. The technology also allows memory stacking layers to be increased by more than 1.5 times.
The technology is expected to appear first in later versions of the Exynos 2800 or Exynos 2900 mobile processors, according to a media report. Samsung has not confirmed the exact launch window for these chips.
Some experts cited in the report suggest that research and mass production of mobile HBM may lag behind the current roadmap. It remains unclear when Multi-layer Stack FOWLP will reach commercial production.
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