Cooler Master and G.SKILL are teaming up on a new DDR5 memory module that uses active cooling to keep temperatures down under heavy workloads. The MasterDimm AC targets users who push their systems hard, offering higher stability when running large capacities.
New module targets heavy workloads with active cooling technology
The module supports up to 64GB per stick in a dual-channel setup. It features AMD EXPO profiles reaching DDR5-6000 with CL26 latency and Intel XMP 3.0 support for speeds up to DDR5-8400 on compatible CU-DIMM motherboards.
Specifications
- Capacity: Up to 64GBx2
- AMD EXPO Profile: DDR5-6000 CL26
- Intel XMP 3.0 Profile: Up to DDR5-8400 CU-DIMM
- Active Cooling Temp Improvement: Up to -15°C
- Acoustic Profile: 35dB or lower
Active cooling inside the module lowers temperatures by as much as 15 degrees Celsius compared to standard passive designs. The system keeps noise levels at or below 35 decibels, which stays within a quiet range for most desktop environments.
Cooler Master plans to show the MasterDimm AC on its Taipei booth during Computex 2026. Exact retail pricing and launch dates remain undisclosed at this time.
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