Rapidus Targets 600mm Glass Interposers for 2030 Advanced Packaging

Rapidus has shifted its advanced packaging strategy toward large-scale glass interposers, a move that could reshape how high-performance chips are assembled by 2030. The Japanese semiconductor startup aims to produce 8-reticle interposers with a total area of 6640 square millimeters. This expansion targets the growing demand for efficient chiplet integration in AI and high-performance computing hardware.

Japanese startup outlines roadmap for large-scale panel-level packaging

The core of this roadmap relies on panel-level packaging using 600x600mm glass substrates. Rapidus plans to launch a pilot line for Rapidus Chiplet Solutions in fiscal year 2026 to verify 2.xD and 3D packaging technologies. The company is also developing an 'Innovative Integration and Manufacturing' model that combines front-end and back-end processes under one roof using AI and sensor data.

• Target Interposer Size (2030): 8 Reticle (6640mm²)
• Panel Level Packaging Target: 600x600mm
• Organic Substrate Size (2030): 14400mm²
• Yield Comparison (8 Reticle): 4 (300mm Wafer), 9 (300x300mm Panel), 36 (510x515mm Panel), 49 (600x600mm Panel)
• TSMC CoWoS Comparison: 5.5 Reticle (2026), 9.5 Reticle (2027), 14 Reticle (2028)

Yield projections highlight the potential efficiency gains of larger panels. Rapidus estimates that a 600x600mm panel can produce 49 chips for an 8-reticle interposer, compared to just 4 from a 300mm wafer. The company utilizes Lam Research's Kallisto electroplating system to support this 2.xD packaging approach on 600mm glass carriers. Organic substrates are also expected to expand to 14,400 square millimeters by 2030.

Industry comparisons show that TSMC is advancing its CoWoS roadmap more rapidly in the near term. TSMC targets 5.5-reticle sizes by 2026, 9.5-reticle by 2027, and 14-reticle by 2028. Rapidus aims for mass production of its large glass interposers by 2028, with a prototype unveiling targeted for late 2025. We've been tracking Rapidus closely — see our earlier coverage on Rapidus Unveils Advanced Packaging Roadmap Targeting.