Huawei has announced plans to develop 1.4 nm chipmaking technology by 2031. The company aims to compete directly with TSMC's leading-edge manufacturing capabilities. This strategic move targets the semiconductor industry as global competition intensifies.
Company plans logic folding tech for higher transistor density without EUV tools by 2031.
Huawei will employ a technique called logic folding to achieve higher transistor density without relying on extreme ultraviolet lithography tools. This method involves stacking two chips on top of each other. The next-generation Kirin 2026 processor may be one of the first commercially available chips to utilize this approach. Huawei and SMIC also plan to breach the 5 nm barrier using self-aligned quadruple patterning technology.
China has reportedly built a functional EUV machine prototype with assistance from former ASML engineers. This development remains unconfirmed as the source states the machine is not yet operational. The timeline suggests it could become functional by 2031, aligning with Huawei's broader manufacturing goals.
This announcement positions Huawei to challenge established foundry leaders in advanced node production. The company focuses on alternative methods to bypass traditional EUV dependencies. Industry observers note that such advancements could reshape the global semiconductor landscape if successful.
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