Samsung will retain advanced packaging for its upcoming Exynos 2700 chipset, contradicting earlier rumors that the company planned to drop the technology to cut costs.
FOWLP benefits explained
The Exynos 2700 will use Samsung's second-generation 2nm GAA process and Fan-Out Wafer-Level Packaging (FOWLP). FOWLP makes chipsets 40% smaller and 30% thinner, and improves thermal resistance by 16%. According to Samsung, the packaging helps the chip deliver better sustained performance under intensive workloads.
The Exynos 2700 is expected to compete against Qualcomm's Snapdragon 8 Elite Gen 6 Pro and MediaTek's Dimensity 9600 Pro.
A leaker noted that Samsung could still remove FOWLP when the chip enters mass production later this year. Samsung has not confirmed the final packaging decision.
Discussion
0 comments
Log in to join the thread with a thoughtful take, question, or correction.