Noctua and Carbice Corporation announced a strategic partnership on June 1, 2026. The collaboration focuses on developing thermal interface materials for the DIY PC market. Both companies will showcase their joint technology at COMPUTEX 2026.
New thermal pad replaces traditional paste with carbon nanotube technology
The first product from this partnership is the NT-CP1 AM5/4. This thermal pad targets AMD Socket AM5 and AM4 platforms. It serves as a direct alternative to traditional thermal paste for CPU cooling applications.
The NT-CP1 utilizes Carbon Nanotube (CNT) technology developed by Carbice Corporation. Noctua integrates this material into its standard cooler assembly process. The design aims to simplify installation while maintaining consistent thermal performance over time.
Noctua positions the product as a long-term solution for PC builders. The company highlights ease of application compared to manual paste spreading. Carbice contributes its specialized heat conduction expertise to the project.
Pricing and specific release dates remain unconfirmed at this stage. Noctua intends to launch the NT-CP1 under its main brand name in global DIY channels. Availability details will likely emerge following the COMPUTEX 2026 demonstration.
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