Maxsun iCraft Z890 ITX Wi-Fi Motherboard Features Active Cooling at Computex

Maxsun revealed the iCraft Z890 ITX Wi-Fi motherboard at Computex 2026. The board targets users who need compact builds with high-end Intel support. It brings active cooling to a small form factor that usually relies on passive heat dissipation.

Compact motherboard brings active cooling to VRM and M.2 heatsink for Core Ultra 2 series processors.

The motherboard uses the Intel LGA-1851 socket for Core Ultra 2 series processors. Maxsun designed the layout to handle CPUs with up to 250W TDP, such as the Core Ultra 9 285K. The compact ITX design fits into small chassis while maintaining support for these power-hungry chips.

Active cooling fans sit on both the VRM and M.2 heatsink located under the PCIe slot. This setup forces air through the storage module to keep temperatures stable during heavy loads. The board also includes a front M.2 slot, a rear M.2 slot, and four Slim SAS SFF-8654 SSD connectors for extensive storage.

Connectivity options include Wi-Fi 7, Bluetooth 5.4, and a Realtek 5G LAN port. The rear I/O panel provides three Type-C ports running at 20 Gbps and six Type-A ports at 10 Gbps. Memory support relies on two DDR5 slots to fit the limited space of an ITX board.

Maxsun showcased this model as part of its iCraft line for enthusiast builders. The company focuses on providing robust features in a footprint that fits smaller cases. The iCraft Z890 ITX Wi-Fi motherboard continues Maxsun's focus on compact desktop solutions.