Intel 18A-P, 14A Gain Cadence EDA Certification to Challenge TSMC

Intel 18A- P and 14A gain Cadence EDA certification, providing chip designers with verified reference flows for RibbonFET and PowerVia technologies.

Intel 18A-P and 14A process node certification announcement
Intel 18A-P and 14A process node certification announcement

Foundry is tightening its ecosystem to challenge TSMC by securing Cadence certification for its advanced 18A-P and 14A process nodes. This certification ensures that chip designers can use a full suite of electronic design automation tools to build next-generation silicon on Intel's manufacturing lines. Buyers and fabless companies relying on these advanced nodes now have verified reference flows to accelerate their design cycles. The move signals Intel's push to reduce the gap in foundry readiness compared to its primary competitor.

Intel 18A-P and 14A process node certification announcement
Intel and Cadence have certified their advanced packaging and EDA flows for Intel 18A-P and 14A.

Chip designers get verified flows for RibbonFET and PowerVia nodes

Cadence has certified its AI-driven digital and custom reference flows, tools, and solutions for Intel 18A-P and Intel 14A. The certification relies on the latest Intel Foundry process design kits to ensure accuracy and compatibility. Intel and Cadence co-optimized these tools to leverage specific innovations in the new process technologies. This partnership covers the entire design workflow from initial synthesis through to final analog and custom design stages.

  • Certification Status: Cadence AI-driven digital and custom reference flows, tools, and solutions certified for Intel 18A-P and Intel 14A
  • Technology Nodes: Intel 18A-P, Intel 14A
  • EDA Partner: Cadence
  • Key Technologies: RibbonFET Gate-all-around transistors, PowerVia, PowerDirect, EMIB, EMIB-T

The certified toolchain supports critical steps including synthesis, place-and-route, timing and power signoff, and physical verification. Intel and Cadence also co-developed an advanced packaging reference design flow that supports EMIB and EMIB-T technologies. These packaging solutions enable the high-density integration of various chip components. The technical foundation includes RibbonFET gate-all-around transistors and advanced backside power delivery features like PowerVia and PowerDirect.

Intel 14A is expected to deliver higher performance at the same power levels compared to Intel 18A. This performance improvement offers a distinct advantage for designers aiming for efficiency and speed in future products. The availability of certified tools allows design teams to proceed with confidence in the stability of the underlying process. Intel continues to develop the necessary software and hardware support to attract more customers to its foundry services.

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