ASML has signed a memorandum of understanding with Tata Electronics to supply lithography equipment for India's first 300mm wafer fabrication facility in Dholera, Gujarat. The fab represents a total investment of $11 billion (₹794.6 billion).
ASML and Tata Electronics sign MoU for Dholera fab
The facility will license process nodes including 28nm, 40nm, 55nm, 90nm, and 110nm from Powerchip. At full load, the fab is designed to produce 50,000 wafers per month. Products will include power management ICs, display drivers, microcontrollers, and high-performance logic for automotive, mobile, AI, and communications applications.
Trial production is targeted for late 2026. Civil construction is approximately 50% complete. The Indian central government funds 50% of eligible costs under the India Semiconductor Mission. The Gujarat government provides subsidized land, power, and stamp duty exemption. The Dholera SEZ was approved in April 2026. A design adjustment due to soft saline soil was made in late 2025 but did not affect the schedule.
Tata Electronics CEO Randhir Thakur said that ASML's overall lithography solution will ensure timely production at the Dholera fab. India joined the US-led 'Silicon Peace' supply chain initiative in February. ASML has not confirmed the exact timeline for equipment delivery.
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