Ibiden plans to significantly expand its production capacity for IC packaging substrates. The Japanese company aims to increase its production load to 1.8 times the 2024 level by 2026 and to 2.4 times by 2028.
Expansion driven by AI and server CPU demand
The expansion is driven by rising demand from Agentic AI, ASICs, and server CPUs. Ibiden has raised its fiscal 2026 revenue forecast for the electronics segment to 330 billion yen. The company also increased its operating profit forecast to 75 billion yen.
The company's move reflects a broader resurgence in CPU demand fueled by artificial intelligence workloads. As AI applications require more processing power, the need for advanced packaging substrates grows.
Ibiden has not confirmed the specific investment amount or timeline for the expansion beyond the production targets. The company's plans are based on its own projections for market demand.
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