HAVN HS 360 case launches for around $149 with curved glass and back-insert motherboard support

HAVN released the HS 360 computer case in China on October 1, 2024. This mid-tower chassis offers a flexible internal layout for builders who prioritize airflow customization and component compatibility. We can see how the design choices balance space efficiency with hardware support for modern components.

Flexible internal layout and back-insert design target ITX builders

The HS 360 follows a mid-tower ATX form factor with dimensions of 490.9 x 242.1 x 520.9 mm. It features a distinctive R7.5mm curved tempered glass front panel. The case supports back-insert motherboards, which simplifies cable management for ITX and mATX builds.

Specifications

• Form Factor: Mid-tower ATX
• Panel Material: R7.5mm curved tempered glass
• Max GPU Length: 430mm
• Max PSU Length: 230mm
• Front I/O: 1x USB-C 10Gbps, 2x USB-A 5Gbps, 1x 3.5mm Audio

Internal clearance supports GPUs up to 430mm in length and PSUs up to 230mm. CPU coolers must not exceed 170mm in height. The front I/O panel includes one USB-C port at 10Gbps, two USB-A ports at 5Gbps, and a 3.5mm audio jack.

The right-side installation area allows flexible combinations of three 120mm fans or two storage bays. Users can also choose one fan slot plus one storage bay. The standard edition costs 999 CNY (around $149).

A VGPU kit is available for 1499 CNY (around $223). This kit includes a vertical GPU mount, a PCIe Gen5 riser cable, and an airflow guide. The case is currently available through Chinese e-commerce platforms.