AMD's next-generation X970E chipset is rumored to use the same Promontory 21 chip as current 800 and 600 series motherboards. The chipset is being developed by ASMedia.
The key upgrade is expected to come from a new I/O die for Zen 6 processors, codenamed 'Olympic Ridge'. This die will support higher memory clocks and add CUDIMM and CAMM memory support. According to a tipster, CUDIMM and CAMM support may be exclusive to the 900 series chipset.
AMD is reportedly preparing an EXPO 1.2 update to enable CUDIMM support. The new memory features would allow for faster and more efficient memory configurations on upcoming platforms.
The X970E chipset would represent a modest update over existing chipsets, relying on the same PROM21 base. The main innovation lies in the processor's I/O die rather than the chipset itself. AMD has not confirmed the rumored specifications or the launch window for the X970E.



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