TSMC has officially established production plans for its 1nm process. The company is building 12 new wafer fabs to support manufacturing from 2nm down to 1.4nm. Mass production of 1nm chips is expected in 2030 or 2031.
TSMC builds 12 fabs for 1nm
The 1nm timeline depends on land acquisition for the Longtan Phase 3 expansion project. That project is scheduled to break ground in 2029. TSMC's roadmap covers advanced nodes through the early 2030s.
Samsung is also pursuing 1nm production and aims to begin wafer manufacturing by 2029. However, the company faces internal labor disputes and low yield issues that could affect its schedule.
TSMC has not confirmed the exact launch window for 1nm mass production. The 2030-2031 target remains conditional on the progress of land acquisition and facility construction.
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