Alpenföhn has released the Ben Nevis 2, a low-profile tower CPU cooler designed specifically for compact PC builds. This release matters because it offers a viable cooling solution for users who need to fit high-performance hardware into small form factor cases without sacrificing thermal headroom. The 124mm height allows the cooler to clear standard RAM modules in tight spaces.
Compact 124mm tower supports Intel and AMD platforms with 180W cooling
The cooler targets desktop platforms from both major chipmakers with broad socket support. It works with Intel Socket V and H series, as well as AMD AM5 and AM4 platforms. This compatibility ensures that users on older AM4 systems or newer AM5 boards can use the same unit.
Alpenföhn rates the Ben Nevis 2 for a 180W TDP dissipation capacity. The unit uses four 6mm heatpipes to transfer heat from the base to the aluminum fins. A 92mm fan drives the airflow through the heatsink stack.
The included fan operates between 500 and 2,000 RPM using hydraulic bearings. It delivers a maximum airflow of 61 cubic meters per hour with a static pressure of 2.21 mmAq. The manufacturer lists the maximum noise level at 29.3 dB(A). The package also includes Thermal Grizzly Hydronaut thermal paste for installation.
The Ben Nevis 2 is a new hardware entry for Alpenföhn in the low-profile cooling segment. The company announced the product on October 13, 2024. Current details confirm the specifications and compatibility, but pricing and availability information are not yet public.
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