TSMC Secures Land for Two 1.4nm Plants, Pilot Production Set for 2027

TSMC has secured land for two new fabrication plants dedicated to its 1.4nm process node, a move that solidifies its manufacturing roadmap for the late 2020s. This expansion ensures the company can meet the growing demand for advanced semiconductor chips from major technology clients. The decision marks a significant step in the company's long-term capacity planning for next-generation hardware.

TSMC acquires 104 hectares in Longtan for 1.4nm fabrication and packaging

The new facilities are part of the Phase 3 expansion at the Longtan Science Park in Taiwan. TSMC acquired a total of 104.19 hectares of land to support this major infrastructure project. The site will also house one panel-level advanced packaging facility to complement the chip production lines.

Specifications

• Process Node: 1.4nm
• Facility Count: Two 1.4nm plants and one packaging facility
• Land Area: 104.19 hectares
• Location: Longtan Science Park Phase 3
• Pilot Production: H2 2027

Construction relies on an initial investment of $49 billion, which funds the building of four plants in total. Pilot production for the 1.4nm process is scheduled to begin in the second half of 2027. This timeline aligns with the company's broader strategy to maintain leadership in semiconductor manufacturing.

Apple is expected to leverage these new facilities to introduce its first 1.4nm system-on-chip, the A22 Pro, in 2028. The project previously faced resistance from local landowners, but economic spillover effects and opportunity cost realization changed their stance. TSMC is also advancing its 2nm node, aiming for 100,000 monthly wafers by the end of 2026. We looked at Apple A22 Pro Chipset on 1.4nm earlier while tracking Tsmc launches.

The secured land and confirmed timeline provide a clear view of TSMC's production capabilities for the coming years. The 1.4nm plants will serve as a critical bridge between current 2nm technology and future nodes. This infrastructure supports the next wave of high-performance computing devices.