Huawei Kirin 9030 Pro for Mate 90 Said to Match TSMC 3nm Node

Huawei's next flagship chip for the Mate 90 is rumored to match TSMC's 3nm process node using older DUV lithography and a novel architecture. The claim comes from a report by Kipost, though no evidence has been provided to support it. If true, it would mark a significant leap for Huawei's in-house silicon.

Rumor claims DUV lithography achieves 3nm-class density

The chip, reportedly called Kirin 9030 Pro, is expected to power the Mate 90 smartphone. Huawei is said to be timing the Mate 90 launch around Apple's iPhone 18 release, according to the same report. This suggests growing confidence in its competitive position, though the company has not confirmed any details.

The Kirin 9030 Pro is said to use LogicFolding architecture to increase transistor density and achieve stable clock speeds of 5.00GHz, according to WCCFTech. Previous Kirin chips, like the Kirin 9000S, were limited to SMIC's 7nm process. Claims of 5nm production have not materialized so far.

Huawei's primary market remains China, where the lack of Google services may limit global appeal. The company has not announced any plans for international availability of the Mate 90. We looked at Huawei's earlier Kirin chips while covering the Mate 60 series.