Xiaomi Xring O3 ARM Chip Leaks: 4.05 GHz Prime Core, 25% Faster GPU

Xiaomi is developing a second in-house ARM system-on-chip named Xring O3, with an expected launch window in 2026. The chip reportedly skips traditional big cores in favor of a new cluster structure. This design choice marks a significant architectural shift for the company's internal silicon efforts.

Leak data suggests the Prime core is roughly 4 percent faster than before

The Xring O3 features a Prime core running at 4.05 GHz. A Titanium Core operates at 3.42 GHz. Heavily upgraded little cores reach a clock speed of 3 GHz. The GPU clock speed increases from 1.2 GHz to 1.49 GHz.

Leak-based performance claims suggest the Prime core is approximately 4% faster than the previous generation. The GPU is reported to be almost 25% faster if the leak proves accurate. These metrics come from sources including Ximitime and Notebookcheck.

The chip is expected to power Xiaomi's next foldable device. The final product name remains unconfirmed. It could be called Mix Fold 5 or Xiaomi 17 Fold. The specific ARM cluster architecture is also not yet confirmed, though the current Lumex generation with C1 Ultra and C1 Pro cores is suspected.

Vendor X has not confirmed the launch window or final specifications for the Xring O3.