Thermal Grizzly is showcasing a new extreme-cooling solution at COMPUTEX 2026 that pushes the boundaries of traditional heatsink design. The company introduced the Mycro Direct-Die Diamond, an open-IG cold plate featuring a layer of diamond film deposited directly onto the metal surface. This approach aims to leverage the material's superior thermal conductivity compared to copper for more efficient heat dissipation.
Diamond film deposition on cold plate aims to beat copper heat dissipation
The primary advancement centers on the specialized method for depositing the diamond film onto the heatsink surface. The cold plate utilizes Chemical Vapor Deposition (CVD) to construct a thin diamond film inside the open-IG heatsink structure. A subsequent thin metal layer is applied over the diamond surface, which improves how liquid metal wets and couples with the copper base of the cold plate.
Thermal Grizzly has noted that the high cost associated with this CVD process limits the Mycro Direct-Die Diamond to industrial feasibility studies rather than consumer products. The company plans to transition to Physical Vapor Deposition (PVD) nickel deposition for mass production, which offers better commercial viability than traditional plating or diamond coatings.
Thermal Grizzly also presented additional cooling technologies during the showcase, including advanced fan designs and coated heat spreaders. The company partnered with PLATIT to introduce PVD and PECVD coated variants of its TG X (nickel) and TG C (carbon) products for enhanced surface stability. Additionally, the DeltaMate Fan – P Series was showcased, featuring high static pressure fans built with CNC aluminum frames and USB daisy-chaining support.
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