Huawei has released the OceanDisk 1800, a new solid-state drive designed for AI inference and data center applications. The company introduced two initial capacity options of 61.44TB and 122.88TB. A larger 245TB variant is expected to arrive in the future.
New Die-on-Board packaging allows mounting NAND dies directly on PCB for AI data centers.
The storage device utilizes Die-on-Board packaging technology to mount NAND dies directly onto the printed circuit board. This approach allows Huawei to bypass traditional BGA or TSOP limits by cramming more memory chips into a smaller footprint without stacking them vertically. The design addresses specific thermal management and signal integrity challenges inherent to this mounting method.
Huawei developed this proprietary storage architecture to circumvent US sanctions on advanced 3D NAND chips. The move aims to decouple the company from U.S. tech supply chains amid ongoing export restrictions that limit access to cutting-edge semiconductor components.
The OceanDisk 1800 targets the domestic Chinese market as part of a broader effort to build self-sufficient hardware infrastructure. Blocks & Files reported on the development and technical specifications of the new storage solution.
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