AMD plans to introduce its next-next-generation Zen 7 architecture for high-performance computing, according to a recent report. The leak suggests the company will adopt panel-level packaging technology from PTI for the first time in this upcoming generation.
Next-gen AMD architecture details revealed with advanced packaging technology.
The architecture relies on TSMC's A14 process node and features significant core count increases over previous designs. Standard Zen 7 chiplets reportedly contain 16 cores, enabling a dual-chiplet desktop processor with 32 cores. This configuration represents a substantial jump from the 24-core setup found in the current Zen 6 generation.
AMD has already certified an industry-first 2.5D panel-level EFB interconnect using FOPLP technology through PTI. The company recently deepened its packaging partnerships with ASE, SPIL, and PTI to support these advanced manufacturing techniques for future silicon releases.
Server deployments of the Zen 7 architecture are expected to begin in 2028, while consumer desktop versions will likely arrive no earlier than 2029. The company has not confirmed specific launch windows or pricing details for these upcoming processor families.
Discussion
0 comments
Log in to join the thread with a thoughtful take, question, or correction.