Micron Begins Sampling 256GB DDR5-9200 RDIMM for AI and HPC Servers

Micron announces sampling of 256GB DDR5-9200 RDIMM server memory modules using 1-gamma DRAM and 3D stacked dies, targeting AI and HPC workloads.

Micron Begins Sampling 256GB DDR5-9200 RDIMM for AI and HPC Servers

Micron has started sampling its new 256GB DDR5-9200 RDIMM memory modules for servers. The modules are designed for AI infrastructure, hyperscale data centers, and high-performance computing deployments.

Sampling with select ecosystem partners

The 256GB RDIMM uses Micron's 1-gamma DRAM technology and 3D stacked DRAM dies with through-silicon vias (TSV). It operates at a speed of 9200 MT/s. According to Micron, a single 256GB module reduces power consumption by over 40 percent compared to using two separate 128GB modules.

Specifications

  • Capacity: 256 GB
  • Speed: 9200 MT/s
  • DRAM Technology: 1-gamma DRAM
  • Packaging: 3D stacked DRAM dies with TSV

Sampling is currently underway with select ecosystem partners. Micron has not disclosed a timeline for broad production.

The new memory targets workloads that require high capacity and bandwidth, such as AI training and inference. By offering a single 256GB module, Micron aims to simplify server design and reduce energy costs for large-scale deployments.

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