Kioxia 9th-Gen BiCS FLASH NAND Samples Ship With 4.8Gb/s Speeds

Kioxia has started shipping samples of its new 1Tb TLC NAND flash memory, marking a shift in how storage density and performance intersect for next-generation devices. This development matters because it introduces a component that claims to match the speed of a yet-to-be-released generation, potentially simplifying the upgrade path for AI-enabled PCs and smartphones. Buyers interested in efficient, high-density storage for mid-range devices should watch this closely as it sets a new baseline for capacity per chip.

New 230-layer TLC chips target AI PCs and smartphones with mid-range storage needs

The product in question is the 9th-generation BiCS FLASH memory, which utilizes a 230-layer stacking process to achieve its 1Tb density. Kioxia describes this as a Triple-Level Cell (TLC) device designed specifically for low-to-mid level storage capacities in AI-enabled PCs and smartphones. This focus on mid-range applications suggests a strategy to bring high-density storage to more accessible devices rather than just high-end flagship models.

Specifications

• Technology Generation: 9th-gen BiCS FLASH 3D
• Density: 1Tb (terabit)
• Cell Type: TLC (Triple-Level Cell)
• Layer Count: 230-layer
• Interface Speed: 4.8Gb/s

Technical specifications for the 9th-gen BiCS FLASH include a NAND interface speed of 4.8Gb/s, which represents a 33% improvement over the 8th generation devices. The 230-layer stacking process enables higher performance and storage capacity while maintaining a compact physical size. These specs are based on the current sample shipments, which serve as the initial reference point for the technology's capabilities.

Kioxia claims that this 9th-gen hardware matches the performance of 10th-gen devices, indicating a two-track strategy where they offer both generations to the market. However, the company notes that mass-produced specs may differ from the sample specs currently being shipped. This caveat is important for manufacturers relying on these samples for final product design, as final performance could vary once full-scale production begins.

The sample shipments commenced on July 29, 2026, with global availability for initial testing and integration. This timeline allows device makers to begin incorporating the new storage into prototypes for upcoming AI-centric hardware. The move positions Kioxia to compete effectively in the growing market for efficient, high-capacity storage solutions.