Samsung Electronics plans to expand its advanced semiconductor packaging operations with a potential new facility in Gwangju, South Korea. The company may announce the project by late June during a scheduled meeting between President Lee Jae-myung and business leaders. This development would mark Samsung's first dedicated packaging base since it established the Onyang Campus 35 years ago.
Samsung Electronics targets major capacity increases at its Cheonan facility to support high-bandwidth memory production by late 2026.
Samsung targets significant capacity increases at its existing Cheonan facility to support high-bandwidth memory production. The company aims to reach monthly processing volumes of 231,000 thermo-compression bonding units and 19,500 hybrid bonding units by late 2026. This expansion focuses on back-end processing capabilities for advanced packaging technologies.
The Cheonan facility expansion supports Samsung's long-term technology roadmap that shifts from thermo-compression bonding to hybrid bonding methods. Samsung plans to transition its high-bandwidth memory stacking processes to hybrid bonding by 2029. The company intends to increase investment in next-generation packaging equipment to execute this technical shift.
Samsung also pursues international expansion through a proposed semiconductor test plant in Vietnam. Reuters reports that the company plans to invest approximately $1.5 billion for construction and operations at this site. Samsung targets November 2027 for the start of production activities at the Vietnamese facility.
SK Hynix considers establishing its own packaging base in South Korea's Honam region, which includes South Jeolla Province. The company currently invests 19 trillion won in a separate packaging and testing facility in Cheongju. The proposed Gwangju facility would allow Samsung Electronics to expand its advanced packaging capabilities alongside existing industry competitors in the region.
Samsung confirms its strategic focus on expanding advanced packaging capacity across multiple locations. The company targets specific monthly processing volumes at Cheonan while planning technology transitions by 2029. Reuters reports the Vietnam investment proposal, and local media indicate Samsung may announce the Gwangju project in June.
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