Asetek introduced two new all-in-one liquid cooling platforms at Computex 2026. The Emma V3 and Ingrid G9 architectures target AI workstations and high-density PCs. These updates aim to lower thermal resistance and reduce acoustic volume under typical loads.
New AIO liquid cooling architectures reduce thermal resistance and acoustic volume for AI workstations.
The Emma V3 platform reduces thermal resistance by 1.5 degrees Celsius compared to its predecessor. It also cuts acoustic volume by approximately 45 percent during standard operation. The Ingrid G9 design focuses on CPU temperature management for mainstream systems.
Ingrid G9 delivers up to a 3-degree Celsius reduction in CPU temperatures versus earlier models. Asetek splits this platform into Mainstream and Value tiers. The Mainstream tier operates at 18 to 20 decibels under load.
Asetek partners with ADATA, NZXT, TRYX, ASUS, Antec, ASRock, and Phanteks for ecosystem implementations. These manufacturers integrate the new cooling architectures into their respective workstation builds.
The company unveiled these platforms during Computex 2026. The announcement highlights a shift toward quieter thermal management for AI-centric hardware setups.
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