Enplas introduces a new water block design that uses injection molding to create pure-copper cold plates. The company showcases this technology at Computex 2026 as part of its effort to improve cooling efficiency for high-TDP components like AI GPUs and server CPUs.
New injection-molded cold plates offer superior surface area for high-TDP components.
The product relies on topology-optimized microfin lattices rather than traditional extruded copper fins. Enplas specializes in injection molding manufacturing, which allows it to produce these complex internal structures at scale.
Specifications
- Material: Pure Copper
- Design Type: Topology-optimized microfin lattice
- Manufacturing Method: Injection molding
The lattice design provides significantly higher surface area for heat dissipation compared to standard copper microfin layouts. This increased surface area helps move more heat away from the cold plate during operation.
Enplas does not list specific pricing or release dates for this water block technology. The company only mentions Computex 2026 as the venue where it will demonstrate the prototype and discuss future availability.
Discussion
0 comments
Log in to join the thread with a thoughtful take, question, or correction.