Maxio UFS 3.1 Embedded Controller Chip Enters Mainstream Smartphone Supply Chain

Maxio Technology has successfully introduced its first UFS 3.1 embedded controller chip to domestic core customers, marking a significant step in the company's storage component portfolio. The chip has completed testing at multiple mainstream smartphone manufacturers and is progressing smoothly toward broader adoption. Maxio's progress with this chip strengthens its role within China's supply chain for fast mobile storage components.

First UFS 3.1 embedded controller chip reaches mainstream smartphone manufacturers for faster mobile storage integration

The UFS 3.1 embedded controller chip targets the mainstream smartphone market, offering a balance of performance and power efficiency. The company's focus on this market corresponds to increasing requirements for higher data throughput and better power efficiency in portable electronics. The company has already established relationships with several major smartphone brands, indicating strong industry interest.

• Product Type: UFS 3.1 Embedded Controller Chip
• Target Market: Domestic Core Customers / Mainstream Smartphone Manufacturers
• Mass Production Timeline: Expected to contribute mass production revenue starting in 2026
• Enterprise Product Focus: PCIe Gen6/Gen7 SSD Controller Chips
• R&D Focus Areas (2026): Low-power SoC chips, automotive functional safety, high-speed interface technologies

Key technical specifications include support for UFS 3.1 standards, which enable higher read/write speeds compared to previous generations. Engineered for compatibility with current mobile hardware designs, the controller aims to streamline integration processes for device producers. The company's emphasis on embedded controllers reflects a broader effort to expand its presence in the internal storage sector.

In addition to the UFS 3.1 chip, Maxio is expanding its product lineup with PCIe Gen6/Gen7 SSD controller chips. The firm's upcoming SSD controller projects target technical advancements relevant to high-capacity data storage applications. Funding from the company's capital raising initiative supports ongoing research into advanced storage technologies and interface standards.

Mass production revenue from the UFS 3.1 chip is expected to begin contributing to Maxio's financial results starting in 2026. The projected schedule aligns with standard industry timelines for developing new semiconductor products and preparing them for mass production. The company plans to continue expanding its customer base among more terminal smartphone manufacturers throughout this period.

Looking ahead, Maxio's R&D efforts will maintain high intensity across multiple frontiers. In 2026, the company will focus on low-power SoC chips, automotive functional safety, and high-speed interface technologies. The company plans to continue research into low-power system-on-chip designs, automotive safety standards, and high-speed interfaces alongside its storage projects.