Apple is reportedly shifting its iPhone 21 ultrawide camera to Chip On Board (COB) technology, a move that could enable a resolution jump to 200MP and support for 8K video recording. Analyst Ming-Chi Kuo of TF International Securities says the change addresses overheating issues inherent in the current Flip-Chip design. The upgrade targets a launch window around 2028.
Analyst Ming-Chi Kuo predicts a shift from Flip-Chip to Chip On Board packaging for better heat dissipation and optical alignment in the upcoming smartphone.
The transition from Flip-Chip to COB allows for more precise optical alignment and better heat dissipation. These improvements are critical for packing higher resolution sensors into a smartphone without triggering thermal throttling. Sunny Optical is positioned to supply the new camera modules, according to Kuo's analysis.
- Ultrawide Camera Technology: COB (Chip On Board)
- Ultrawide Camera Resolution: 200MP
- Video Recording Capability: 8K video recording
Existing iPhone devices currently utilize 48-megapixel ultrawide cameras that employ Flip-Chip packaging technology. Transitioning to Chip On Board technology could potentially increase this sensor resolution by approximately four times. These upgraded sensor specifications may enable the smartphone to support 8K video recording, marking a significant milestone for the product line.
This technological transition depends on overcoming heat management challenges that previously restricted higher resolution implementations. Apple has not officially confirmed the specifications or the supplier selection. The details remain within the realm of analyst predictions rather than verified product roadmaps.
The iPhone 21 is expected to launch in 2028. No pricing information has been disclosed by Apple or reported by analysts at this time. Availability details are limited to the projected year of release.
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