Intel Foundry to Manufacture Google TPUv8e with EMIB Packaging in 2027

Intel Foundry plans to produce the TPUv8e for Google in the fourth quarter of 2027. The chip will use EMIB advanced packaging technology. Intel Foundry has not confirmed the details of this project. Commercial Times reported that Google will use Intel Foundry for this next-generation tensor processing unit.

The TPUv8e will combine different manufacturing processes. Google will provide the compute die for the chip. MediaTek will handle the I/O and backend components. The compute die will use Intel's 14A process node. Intel Foundry will use its EMIB packaging to integrate these parts.

Intel Foundry claims the TPUv8e design offers lower costs than CoWoS packaging. Commercial Times stated the design provides a more versatile architecture. The performance and cost claims remain unconfirmed by Intel. Official specifications for the TPUv8e have not been released by Intel Foundry.

Intel Foundry to produce Google TPUv8e with EMIB packaging in 2027

The TPUv8e will be available globally starting in the fourth quarter of 2027. A specific launch date for the TPUv8e has not been announced by Intel Foundry. Pricing information for the chip has not been disclosed. Google is reportedly a major Intel Foundry customer and will use EMIB advanced packaging for the next-gen TPU.

The TPUv8e project involves Intel Foundry's advanced packaging capabilities. The TPUv8e project involves Intel Foundry's strategy to attract major cloud providers like Google. Google's reported use of Intel Foundry's EMIB packaging indicates a shift in the semiconductor supply chain. Intel Foundry aims to compete with other advanced packaging providers, offering lower cost and more versatile design compared to CoWoS.

Source: wccftech.com