SK hynix is evaluating Intel's EMIB packaging technology for connecting its high bandwidth memory (HBM) with logic dies. The move comes as TSMC's CoWoS packaging faces supply bottlenecks that are squeezing the AI supply chain.
Intel EMIB-T achieves 90% validation yield
Intel's EMIB-T has achieved a 90% yield, though that figure is a validation result and not yet a production yield. The technology is reportedly growing popular in the industry due to rising AI chip demand, according to Zdnet Korea.
Intel CEO Lip-Bu Tan said the company can drive changes more quickly for customers by combining advanced packaging and foundry services with its CPU business. He noted that Intel is not just a CPU company anymore.
It remains unclear whether SK hynix will commit to EMIB for volume production. The company is still in the evaluation phase and has not confirmed a final decision.
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