Kioxia has broadened its CM9 storage family with the new CM9-DLC PCIe 5.0 NVMe solid-state drive for liquid-cooled data centers. With this announcement Kioxia acknowledges the increasing demand for high density storage solutions that can operate without traditional air cooling to manage the heat associated with AI, ML and other workloads. CM9-DLC can be integrated into liquid-cooled server racks to enable consistent performance under high computing stress.
New drive targets AI and ML workloads with direct liquid cooling support
CM9-DLC supports the EDSFF E3.S form factor to cater for new server designs. It combines Kioxia's BiCS8 TLC flash memory with CMOS directly Bonded to Array (CBA) technology for heat and speed. This combination supports the PCIe 5.0 interface and NVMe 2.0 and NVMe-MI 1.2c protocol for efficient data operations.
Specifications
- Interface: PCIe 5.0, NVMe 2.0
- Form Factor: EDSFF E3.S
- Cooling: Direct Liquid Cooling (DLC)
- Max Sequential Read: 14.8 GB/s
- Max Sequential Write: 11 GB/s
CM9-DLC supports 14.8 GB/s sequential read speed and 11 GB/s sequential write speed. For random operations, the drive offers 3400 KIOPS (queue depth 512) or 800 KIOPS (queue depth 32) read speed. The drive is available in 2 capacities: 30.72TB model (1 DWPD) and 25.6TB model (3 DWPD).
Kioxia claims that the new architecture enables twice as much capacity per device in comparison to earlier models. It also brings substantial gains in power efficiency, performance, density and sustainability, which makes CM9-DLC suitable for highly scalable solutions that require thermal management.
The samples are now available for customer evaluation. Kioxia will demonstrate the CM9-DLC at the upcoming OCP Global Summit. Specific pricing information and CM9-DLC general availability is not available at the moment.
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