PC builders seeking a mid-tower case with a split-chamber layout and dual tempered glass side panels have a new option in FSP's M370. This design aims to separate the GPU and power supply compartments to improve airflow and reduce thermal competition between major components. The case also supports back-plug motherboards, which simplifies cable management for users who want a cleaner interior without routing power cables through the main chamber. Buyers looking for a fresh mid-tower alternative can evaluate these features against their specific build requirements.
Split-chamber design separates components for improved airflow and cable management
FSP introduced the M370 as a mid-tower ATX chassis built from 0.6 to 0.8mm SPCC steel. The physical dimensions of the case are 242x430x475 mm, providing a standard footprint for most desk setups. The internal layout accommodates GPUs up to 400mm in length and power supplies up to 220mm. It also supports CPU coolers with a height clearance of 180mm, ensuring compatibility with most air coolers on the market.
Specifications
- Form Factor: Mid-tower ATX
- Dimensions: 242x430x475 mm
- GPU Clearance: 400mm
- Pre-installed Fans: 4x 120mm PWM ARGB
- Front I/O: 2x USB-A 5Gbps, 1x USB-C
The M370 includes seven expansion slots for add-in cards and supports back-plug motherboard configurations. Storage options include one dedicated 3.5-inch drive bay and a second bay that can hold either one 3.5-inch drive or two 2.5-inch drives. The front I/O panel features two USB-A ports rated at 5Gbps and one USB-C port for modern connectivity. These ports provide essential access for peripherals and data transfer without requiring users to reach behind the desk.
Airflow is managed by four pre-installed 120mm PWM ARGB fans. Three of these fans are positioned at the front intake, and one is mounted at the rear exhaust. The top of the case supports additional cooling configurations, including three 120mm fans, two 140mm fans, or a 360mm AIO liquid cooler. This flexibility allows builders to customize thermal performance based on their component heat output and noise preferences.
The M370 represents FSP's entry into the consumer PC case market with a focus on thermal separation and back-plug compatibility. The announcement highlights specific hardware support for large GPUs and modern storage configurations. Builders can now assess whether the split-chamber design and pre-installed fan array meet their needs for a mid-tower build.
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