AMD Versal Premium Gen 2 MoP Integrates 32GB LPDDR5X Memory

Engineers designing industrial and aerospace systems face a complex routing challenge when integrating high-speed memory into compact hardware. AMD addressed this constraint by releasing the Versal Premium Gen 2 Memory on Package (MoP), which embeds memory directly into the processor package. This approach eliminates the need for designers to draw high-speed traces on the main circuit board, significantly simplifying the physical layout. The change matters because it reduces the risk of signal integrity issues and shrinks the overall footprint of the final device.

New chip package eliminates complex high-speed memory routing

The new MoP variant is built on the Versal Premium Gen 2 adaptive system-on-chip platform. It integrates up to 32GB of LPDDR5X memory directly into a single chip package. This integration provides a memory bandwidth of up to 288GB/s. The technology uses a 0.4mm interconnect pitch to link the memory to the processor. This tight spacing removes the need for complex high-speed memory routing on the motherboard.

Specifications

• Integrated Memory Capacity: 32GB LPDDR5X
• Memory Bandwidth: 288GB/s
• PCB Area Reduction: Up to 60%
• Interconnect Pitch: 0.4mm
• Operating Temperature: -40°C to +110°C

The MoP design reduces the required printed circuit board area by up to 60% compared to traditional board-mounted memory solutions. It supports an operating temperature range from -40°C to +110°C, meeting industrial-grade certification requirements. The component offers lifecycle support for more than 15 years. This long-term availability contrasts with High Bandwidth Memory options, which are typically anchored to data center use cases and lack similar longevity.

The hardware integrates CXL 3.1 and PCIe 6.0 interface IP to enable high-speed data transfer. The LPDDR5X memory supports data rates up to 9000Mb/s, with transfer speeds reaching 64Gb/s. AMD states that using pre-validated on-die LPDDR5X interfaces shortens development cycles and reduces design risks. This pre-validated approach allows engineers to bypass the complex verification steps usually required for custom memory interfaces.

Standard Versal Premium Gen 2 devices are currently shipping to customers. The MoP version will provide samples at the end of 2026. Mass production for the MoP variant is scheduled to begin in the second half of 2027. This timeline allows industrial and defense sectors to plan their hardware updates well in advance of the final product launch.

The release confirms AMD's strategy to provide robust, long-life memory solutions for critical infrastructure. The MoP technology offers a compact, high-bandwidth alternative to traditional memory mounting methods. This shift enables more reliable hardware designs for environments where space and temperature stability are paramount.