Intel and Cadence Sign Multi-Year Pact to Co-Optimize 14A Process Node

Intel and Cadence signed a multi-year agreement to co-optimize the company's 14A process technology. The partnership aims to improve performance, power efficiency, and time-to-market for customers using the node.

Cadence supplies AI-driven design tools for Intel's advanced semiconductor manufacturing roadmap

Cadence will supply AI-driven electronic design automation tools and Design Technology Co-Optimization services for the 14A process. Intel plans to use the 14A process for its own internal products as well as external customer chips.

The collaboration focuses on advancing semiconductor manufacturing technology through advanced chip design tools and co-optimization strategies. The collaboration aims to accelerate product launches by optimizing design workflows through advanced co-optimization techniques.

Intel has not officially named major customers for the 14A process node yet. The company prefers to let its partners announce deals publicly rather than disclosing them directly.

Anirudh Devgan, president and chief executive officer of Cadence, called the expanded partnership a major milestone for both companies. Naga Chandrasekaran, executive vice president and general manager of Intel Foundry, stated that the collaboration reflects Intel's focus on delivering its technology roadmap.