Google Orders Intel to Package Over 3 Million TPUs in 2028

Google has placed an order for Intel to package more than 3 million TPUs in 2028. The deal signals growing demand for Intel's advanced packaging as an alternative to TSMC's CoWoS, which is at capacity.

Google orders over 3 million TPUs for 2028

Intel's EMIB (Embedded Multi-die Interconnect Bridge) technology is the packaging method at the center of these deals. SK hynix is testing EMIB for HBM integration, and Nvidia is evaluating Intel for packaging a future GPU with four dies using the Feynman architecture in 2028.

Intel claims EMIB achieves near 90% package utilization, compared to roughly 60% for interposer-class packaging. The EMIB-T variant scales to a 120mm x 180mm package carrying more than 38 bridges and over 12 reticle-sized dies. It supports HBM3, HBM3E, HBM4, and HBM5.

Intel EMIB offers 90% package utilization

Bernstein analysts estimate EMIB packaging costs a few hundred dollars per chip, though they note a lack of an external production track record. By comparison, CoWoS on a Rubin-class processor costs $900 to $1,000 USD.

Intel Foundry lost $10.3 billion in 2025 but is close to closing multi-billion dollar packaging deals. TSMC CEO C.C. Wei said, "It will be a long time before we can meet customer demand," highlighting the capacity crunch.

The reported orders from Google, SK hynix, and Nvidia underscore Intel's push to become a major packaging supplier. While Intel's foundry business faces financial challenges, these packaging deals could provide a significant revenue stream.