Acer Predator DDR4 Memory 32GB Kit Launches with Samsung B-die Chips

Acer introduced the Predator DDR4 memory module for desktop systems. The kit uses Samsung B-die chips and runs at DDR4-3600 with CL16-16-16-36 timings. It ships in a white zinc alloy heatsink and supports Intel XMP 2.0. Acer sells the 32GB (16GB x 2) kit for 1799 CNY on JD.com.

The new desktop memory kit utilizes Samsung B-die chips for stable operation at higher clock speeds.

This DDR4 kit is designed for users seeking dependable performance at higher clock speeds. The kit includes two 16GB sticks to reach a total capacity of 32GB. The module utilizes Samsung B-die memory chips, recognized for their stability under heavy loads and precise timing control. The white zinc alloy heatsink helps dissipate heat from the modules.

Specifications

• Capacity: 32GB (16GB * 2)
• Speed & Timings: DDR4-3600 CL16-16-16-36
• Memory Chips: Samsung B-die
• Heatsink Material: White zinc alloy
• PCB Layers: 10-layer PCB

The kit operates at DDR4-3600 speed with CL16-16-16-36 latency. It supports Intel XMP 2.0 for easy configuration in compatible systems. The manufacturer implemented a ten-layer printed circuit board to enhance signal integrity and overall system stability. Engineering choices focus on delivering consistent performance during intensive computing tasks.

Acer offers a lifetime replacement warranty for this memory kit. The product is currently available only in China through JD.com. It does not include any official performance benchmarks or third-party test results. Purchasers receive a 32GB kit operating at DDR4-3600, leveraging the proven reliability of Samsung’s memory components.

The product expands the Predator series, a collection of hardware typically associated with high-performance computing. This launch follows a history of similar hardware releases from the vendor within this product line. The kit maintains consistent branding elements seen in previous iterations of this hardware series.

The vendor introduced this memory module featuring components selected for their performance characteristics. Integrating Samsung B-die components with a ten-layer circuit board addresses the needs of users prioritizing system reliability. The white zinc alloy heatsink provides both cooling and aesthetic options for builds.