Noctua showcased an improved thermosiphon liquid cooler prototype at Computex 2026. The design uses a sintered copper layer on the evaporator to improve capillary action and prevent insulating bubbles.
Improved thermosiphon liquid cooler prototype matches active AIO performance at Computex 2026
The new cooler employs inlet and outlet hoses positioned on the same side, mimicking active AIO layouts for better motherboard clearance. New hose material reduces permeation and improves seal integrity at connectors.
Side-by-side testing against a 360mm NL-LC1 AIO showed similar CPU temperatures around 80 degrees Celsius when cooling a Ryzen 9 9950X3D at 230W PPT. The prototype maintains passive circulation while matching active liquid cooling performance.
Noctua projects the thermosiphon design for a Q3 2027 launch date. Noctua intends to introduce passively circulated liquid cooling for consumer desktops, offering better thermal performance than existing all-in-one coolers.
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