Segotep showcased its 'Technology Living Room' concept at COMPUTEX 2026 in Taipei. The company highlighted a modular ecosystem of power supplies, motherboards, and cooling solutions designed to simplify PC building. This approach aims to reduce cable clutter and improve airflow within the chassis.
The Shanhai MU-850GD digital power supply features a dual-MCU architecture and CRPS server-grade Lingmou algorithm for high current purity.
The centerpiece is the Shanhai MU-850GD digital power supply. It uses a dual-MCU architecture with a CRPS server-grade algorithm called 'Lingmou' for high current purity. The unit targets users who want precise power delivery without complex manual tuning.
Segotep also introduced the iGAME BTF3.0 motherboard and PSU solution. This platform replaces traditional cables with a 50-pin gold finger connection. The design supports over 1kW of power transfer directly between components, eliminating internal wiring noise.
The LQ360 Ultra Z BTF3.0 AIO cooler complements the ecosystem. It features a short-tube design to minimize airflow interference inside the case. This compact layout helps maintain consistent cooling performance for high-end CPUs.
An in-development unit, the Shanhai MU-1300PD, aims for Platinum efficiency standards. It uses dual MCUs and Infineon CoolMOS PFC technology with native PCIe 5.1 12V-2×6 TITANLOAD cables. This model targets enthusiasts seeking maximum power delivery capabilities.
Segotep presented these products as part of a broader shift toward integrated PC building solutions. The company emphasized reliability and ease of assembly for both builders and end users.
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