Applied Materials has partnered with TSMC at the EPIC Center in Silicon Valley to accelerate AI chip technology. The collaboration aims to overcome challenges in 3D transistor design and advanced logic scaling.
A $5 billion investment targets 3D transistor challenges.
The EPIC Center represents a $5 billion investment in semiconductor equipment research and development. The partnership focuses on materials engineering, equipment innovation, and process integration for next-generation transistors.
The center is expected to be operationally ready this year. Applied Materials President and CEO Gary Dickerson noted the long history of deep collaboration between the two companies based on trust and a shared commitment to advancing innovation at the leading edge of semiconductor technology.
TSMC Executive Vice President and Co-Chief Operating Officer Dr. Y.J. Mii stated that as semiconductor device architectures evolve with each new generation, the demands on materials engineering and process integration continue to increase. The partnership is intended to address these growing demands.
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