BIWIN announced the TGE408 on April 22, 2024. The company introduced this new embedded flash storage component to the market. The product targets industrial and embedded applications that require reliable data retention.
The TGE408 uses an FBGA 153 Ball form factor. It supports the eMMC 5.1 protocol for data transfer. The chip operates within a wide temperature range from -40℃ to +85℃. This design allows the component to function in harsh environments.
Sequential read speeds reach up to 330MB/s. Sequential write speeds achieve up to 220MB/s. The product line includes both pSLC and standard TLC flash memory versions. Users can select the memory type based on their endurance needs.
BIWIN introduces TGE408 eMMC 5.1 with wide temperature support
The pSLC version offers capacities of 8GB and 16GB. This variant supports 100,000 P/E cycles for high durability. The standard TLC version provides 64GB and 128GB capacities. The TLC option supports 3,000 P/E cycles for general use.
BIWIN states the TGE408 achieves full-process localization. The company emphasizes stable operation across the specified wide temperature range. The announcement provides technical specifications for industrial hardware integration.
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