DeepCool AK700 VC Air Cooler Launches with 34% Larger Thermal Base

DeepCool has updated its AK700 line with the new AK700 VC air cooler, introducing a redesigned thermal base that expands cooling capacity without changing the physical footprint. The company kept the original dimensions to ensure the unit fits in most mid-tower cases while delivering higher airflow and static pressure. This update targets builders who need reliable CPU cooling for high-end Intel or AMD processors.

New vapor chamber base and upgraded fan boost airflow while keeping dimensions identical.

The AK700 VC uses a single 157 mm tall tower design that measures 126 x 98 x 157 mm, matching the previous generation exactly. DeepCool pairs this heatsink with an updated fan that spins up to 2700 RPM and delivers 80.37 CFM of airflow. The cooler supports Intel LGA1851, 1700, 1200, and 115X sockets alongside AMD AM4 and AM5 platforms.

Spec comparison

The core upgrade sits in the base plate, which now features a VC2.0 vapor chamber instead of traditional heatpipes alone. This new base increases the effective thermal area by 34 percent compared to the prior model while adding 20 percent more thickness. The copper pillar array inside the chamber also runs 75 percent denser than before.

DeepCool upgraded the fan motor and bearing system, which pushes static pressure to 4.98 mmH2O at maximum speed. The company maintained a 36 dBA noise floor despite the higher RPM, though it slightly reduced peak static pressure from the previous generation. The cooler includes twelve built-in LEDs that turn on by default without a physical switch.

DeepCool lists the AK700 VC at 449 CNY for both black and white color variants. The price reflects a slight increase over earlier models while retaining the same mounting bracket layout. Availability details have not yet been confirmed for global markets.

The new cooler drops the reverse-spin dust-clearing feature that appeared in the original AK700 launch version. DeepCool kept the overall height and width identical to maintain compatibility with existing case layouts and RAM clearance zones.